Heat transfer and cooling
The composition of the air is very loose, so heat transfer is very slow.
The quest for high-end notebook thin, heat is a common dream greedily.
LED energy saving long life, heat dissipation is necessary to overcome the problem.
Heat is the module, Driver to the thermal discharge.
The traditional method is to use fan forced air convection, so that the heat discharged to the atmosphere inside the enclosure.
However, the convection must punch, will soon be dust, noise and short-circuit.
Metal shell of the benefits of better heat transfer, the disadvantage is that too much.
Strictly speaking, the market heat sink and air contact area is increased the heat transfer film. Cooling effect on well.
When all possible methods are used, heat also be cut down, how do?
1. Carbon composite Thermal paste: paste position in the chassis hot outside; 30 seconds immediately effective!
2. Carbon composite Heatsink: IMD molding method used for heat sinks become a part of the case, go directly to the integrated thermal discharge.
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