Wednesday, February 11, 2009
Tuesday, February 10, 2009
ELECTRONIC GRADE ADHESIVES
Manufacturer of Electronic Grade Adhesives /Adhesive films /Preforms for:
APPLICATION:
Chip Cap / Sensors, Electrical Grounding, Smart Card, Disk Drive, LCD, Semiconductor Grade, Chip Scale, Underfill, Lid Seal, Die Attach, Catheter, Optics, Class IV, Probe Cards, Encapsulants, Sealants, SMT, Wet Coil Winding, Coil Tacking, Heat Sink, HGA Assemblies, Pico-Nano Slider Bonds, Voice Coil to Armatures, Bearing Cartiridge, Spindle Motor, HUB to Media, Magnet Assembly, Screw Taper Proofing…..
PROPERTIES:
Flexible, Electrically Conductive, Thermally Conductive, Structural Bonding, Anisotropic, Siloxane, Polyurethane, Low Outgassing, High Temperature Resistant, Moisture Resistant, Low Temperature Cure, Snap Cure, High Humidity
BONDING SURFACES:
Aluminum, Brass, Ceramic, Copper, Ferrite, Glass, Gold, Lead, Mismatched CTE, Nylon, Plastic, Polyamide, Rubber, silver, Solder, Stainless Steel, Steel, PVC, Difficult Surfaces
APPLICATION:
Chip Cap / Sensors, Electrical Grounding, Smart Card, Disk Drive, LCD, Semiconductor Grade, Chip Scale, Underfill, Lid Seal, Die Attach, Catheter, Optics, Class IV, Probe Cards, Encapsulants, Sealants, SMT, Wet Coil Winding, Coil Tacking, Heat Sink, HGA Assemblies, Pico-Nano Slider Bonds, Voice Coil to Armatures, Bearing Cartiridge, Spindle Motor, HUB to Media, Magnet Assembly, Screw Taper Proofing…..
PROPERTIES:
Flexible, Electrically Conductive, Thermally Conductive, Structural Bonding, Anisotropic, Siloxane, Polyurethane, Low Outgassing, High Temperature Resistant, Moisture Resistant, Low Temperature Cure, Snap Cure, High Humidity
BONDING SURFACES:
Aluminum, Brass, Ceramic, Copper, Ferrite, Glass, Gold, Lead, Mismatched CTE, Nylon, Plastic, Polyamide, Rubber, silver, Solder, Stainless Steel, Steel, PVC, Difficult Surfaces
Subscribe to:
Posts (Atom)